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  • APX555B limited our measurement again
  • 4PIN XLR+4.4mm+6.35mm output
  • SE + BAL input pass through
  • Bluetooth 5.0 Trasmission
  • Auto Screen Close
  • Easy to Operate
  • Tablet and Phone Application
  • Support Highest DSD512(Native) and PCM 32Bit/768kHz
  • Bluetooth 5.0 LDAC transmission
  • THD+N as low as 0.00025%
  • XMOS XU208 and customized drivers
  • Auto on/off& Auto screen close
  • USB/Coaxial/Optical DAC application
  • DAC+Pre-amplifier/ Bluetooth receiver/Tablet and phone DAC application
  • Headphone amp Preamplifier application
  • HiRes Audio
  • Ultra High performance NFCA Modules
  • 3 Level Gain Setting
  • Headphone amp and pre-amp
  • 4-pin XLR, 4.4 balanced, and 6.35mm outputs
  • 3-step gain switch 
  • Can drive full-sized headphones and sensitive IEMs
  • NFCA modules
  • THD+N: <0.00006%
  • DNR: 145dB
  • Noise: <0.2uVrms
  • Output impedance: <0.1Ω
  • Maximum output power: 7600mW x2
  • Comfort zone with lowest distortion :The lowest THD+N of PA3s is in the range of 10-20W output, which happens to be the power range commonly used for listening to music. Everything is just in the right condition.
  • With the help of a DAC, the function is expanded to a greater extent :PA3s can be used with a DAC to expand the categories of digital inputs; if used with a DAC+HPA, more comprehen sive functions can be achieved.
  • Balanced + Single- ended inputs :PA3s provides TRS balanced input and RCA single: end- ed input. The u use of balanced input eliminates potential ground loop problems giving the pristinely clean audio without any hum.
  • High output power :PA3s could output 80W x2 at 4ohm load, 10% THD+N. In higher standard of THD+N of 1%,output power will be 65W x2 at 4ohm load. The output power is enough to drive any bookshelf speakers and even some floor speakers.
  • 2xMA12070 Fully balanced Class D amplifier :Each channel of PA3s uses one MA12070 Class D power amplifier chip. This allows separation in layout improving performance and reducing crosstalk. The power is shared across two chips, the heat dissipation is also halved for each chip, improving reliability and extending the lifespan of the product.